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Utveckling av elektronikinkapsling: Utveckling av elektronikinkapsling för sensorlösning hos Brinja AB
2022 (Swedish)Independent thesis Basic level (university diploma), 10 credits / 15 HE creditsStudent thesisAlternative title
Development of electronic enclosure (English)
Abstract [en]

This is an experimental concept study that uses the Design Thinking methodology to explore how a company can improve its encapsulation of a connected sensor solution for concrete measurement. This sensor is used in a construction work environment at an early stage and therefore has certain requirements that must be met to be functional. The enclosure is a standardized electronics enclosure that proved unsuitable for the purpose when the project was done. The problems the company has witnessed are that it is a hassle to change the battery, start/switch off the unit, and that the process for doing this exposes the electronics to the environments at the construction site. The company does not have its own production but buys components from other suppliers and the number of units produced by the company is relatively small, which limits the possibilities for an optimized solution. The enclosure cannot be encapsulated with metal as the radio functionality must not be prevented, which limits the choice of material. Different manufacturing methods have been analyzed regarding cost and the possibility of meeting the requirements set by the company to develop an optimal solution as possible. Based on the implementation of the project, a complete, injection molded electronic enclosure provided by a supplier has been found and proven to be the most optimal solution together with a metal plate assembled on the back of the enclosure. This metal plate makes the product follow the company's design language better, facilitates installation of the unit and can protect the unit in the event of shocks and falls. The conclusion drawn from this project is that injection molding is the optimal manufacturing method when a plastic enclosure is desired. With a lower volume of acquisition of electronic enclosures, it’s more reasonable to purchase a standardized complete injection molded enclosure from a supplier which is then modified to meet specific requirements and the desired design. This is because acquiring your own injection molding tool becomes too expensive at a lower volume of acquisition due to the high initial cost.

Place, publisher, year, edition, pages
2022. , p. 81
Keywords [sv]
elektronikinkapsling, betongsensor, produktutveckling, interaktionsdesign
National Category
Mechanical Engineering Other Mechanical Engineering
Identifiers
URN: urn:nbn:se:hj:diva-57740ISRN: JU-JTH-MTA-1-20220310OAI: oai:DiVA.org:hj-57740DiVA, id: diva2:1678012
External cooperation
Brinja AB
Subject / course
JTH, Product Development
Supervisors
Examiners
Available from: 2022-07-04 Created: 2022-06-28 Last updated: 2025-10-13Bibliographically approved

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Mechanical EngineeringOther Mechanical Engineering

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CiteExportLink to record
Permanent link

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Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
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