ju.se
EnglishSvenskaNorsk
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Investigation of Pressure Dependent Thermal Contact Resistance between Silver Metallized SiC Chip and DBC Substrate
Jönköping University, School of Engineering, JTH. Research area Materials and manufacturing - Surface technology.
Show others and affiliations
2015 (English)In: Materials Science Forum, ISSN 0255-5476, E-ISSN 1662-9752, Vol. 821-823, p. 452-455Article in journal (Refereed) Published
Place, publisher, year, edition, pages
Trans Tech Publications, 2015. Vol. 821-823, p. 452-455
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:hj:diva-28910DOI: 10.4028/www.scientific.net/MSF.821-823.452Scopus ID: 2-s2.0-84950349739OAI: oai:DiVA.org:hj-28910DiVA, id: diva2:892130
Available from: 2016-01-08 Created: 2016-01-08 Last updated: 2025-10-13Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopus

Authority records

Belov, Ilja

Search in DiVA

By author/editor
Belov, Ilja
By organisation
JTH. Research area Materials and manufacturing - Surface technology
In the same journal
Materials Science Forum
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 598 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
v. 2.49.0
|
WCAG
|
Jönköping University
|
Jönköping University Library